CHEMICALS AND MATERIALS FOR SUB-100NM IC MANUFACTURING
出 版 商：The Information Network
出版日期：2016/10/01
價 格：
USD 2,495 (Single-User License)
Chapter 1 Introduction 1-1
Chapter 2 Executive Summary 2-1
2.1 Key Industry Trends 2-1
2.2 Market Outlook 2-4
2.3 Supplier Opportunities 2-6
Chapter 3 IC Industry Trends 3-1
3.1 IC Industry Growth Forecast 3-1
3.2 Trends in IC Processing Technology 3-4
Chapter 4 Liquid Chemicals 4-1
4.1 Technology Issues 4-1
4.1.1 Acids and Solvents 4-1
4.1.2 Resists 4-5
4.2 Purity Requirements 4-14
4.2.1 Purification Methods 4-14
o Trends For Purity - Trace Elements 4-15
4.2.2 Particulates 4-16
o Effects on Yield 4-16
o Particulate Removal Techniques 4-22
o Particle Monitoring 4-23
4.3 Chemical Management 4-24
4.3.1 Introduction 4-24
4.3.2 Chemical Usage Reduction 4-26
Chapter 5 Gases 5-1
5.1 Technology Issues 5-1
5.2 Requirements 5-3
5.2.1 Purification Alternatives 5-3
o Historical Perspective 5-3
o Trends For Purity - Consistency 5-5
5.2.2 Particulate Considerations 5-7
o Particle Monitoring 5-7
o Filtration Methods 5-9
5.2.3 Summary 5-13
Chapter 6 Sputtering and Evaporation Materials 6-1
6.1 Technology Issues 6-1
6.2 Purity Requirements 6-10
Chapter 7 Market Forecast 7-1
7.1 Market Driving Forces & Assumptions 7-1
7.2 Chemicals and Materials Forecast 7-3
7.2.1 Forecast By Chemical and Material 7-3
7.2.2 Chemical Use Per Unit Area Of Silicon Processed 7-21
7.2.3 Market Shares 7-23
Chapter 8 Strategic Customer Issues 8-1
8.1 Benchmarking a Vendor 8-1
8.1.1 Statistical Quality Control 8-1
o Assay and Related Items 8-3
o Trace Elements 8-4
o Particles 8-5
8.1.2 Analytical Capabilities 8-6
8.1.3 Product Manufacturing And/Or Sourcing 8-8
8.1.4 General Considerations 8-9
o Installation and Retrofitting Costs 8-9
8.2 In-House Quality Control And Assurance 8-13
8.2.1 Analytical Tools 8-13
8.2.2 How Much Testing 8-15
8.2.3 Exhaust Gas Analysis 8-16
List of Figures
4.1 Relationship Between Device Yield and Particles 4-18
4.2 Relationship Between Die Yield and Chip Size 4-20
4.3 Chemical Management Services Tasks 4-25
6.1 ITRS Roadmap 6-3
6.2 Gate-Last Approach 6-8
6.3 Gate-First Approach 6-9
7.1 Chemical/Semiconductor Revenue Ratio 7-8
7.2 Worldwide Resist Market 7-12
7.3 Resist/Semiconductor Revenue Ratio 7-13
7.4 2012 Silicon Wafer Market 7-17
7.5 2015 Silicon Wafer Market 7-18
7.6 Cost of Chemicals Per Square Inch of Silicon 7-22
7.7 Worldwide Market Shares for Gas Suppliers 7-24
7.8 Worldwide Market Shares for Liquid Chemical Suppliers 7-25
7.9 Worldwide Market Shares for Photoresist Suppliers 7-26
7.10 Worldwide Market Shares for Silicon Wafer Companies 7-27
7.12 Pricing Trend For Silicon Wafers 7-29
List of Tables
4.1 Common Wafer Processing Chemicals 4-2
4.2 Photoresist Stripping Solutions 4-10
5.1 Gas Control System Issues 5-2
5.2 Potential Hazards of Processing Gases 5-8
7.1 Worldwide Forecast of Chemicals and Materials for IC Manufacturing 7-5
7.2 Worldwide Market Forecast of Si Wafers 7-15
7.3 Worldwide Market Forecast of Sputtering Targets 7-20
Chapter 2 Executive Summary 2-1
2.1 Key Industry Trends 2-1
2.2 Market Outlook 2-4
2.3 Supplier Opportunities 2-6
Chapter 3 IC Industry Trends 3-1
3.1 IC Industry Growth Forecast 3-1
3.2 Trends in IC Processing Technology 3-4
Chapter 4 Liquid Chemicals 4-1
4.1 Technology Issues 4-1
4.1.1 Acids and Solvents 4-1
4.1.2 Resists 4-5
4.2 Purity Requirements 4-14
4.2.1 Purification Methods 4-14
o Trends For Purity - Trace Elements 4-15
4.2.2 Particulates 4-16
o Effects on Yield 4-16
o Particulate Removal Techniques 4-22
o Particle Monitoring 4-23
4.3 Chemical Management 4-24
4.3.1 Introduction 4-24
4.3.2 Chemical Usage Reduction 4-26
Chapter 5 Gases 5-1
5.1 Technology Issues 5-1
5.2 Requirements 5-3
5.2.1 Purification Alternatives 5-3
o Historical Perspective 5-3
o Trends For Purity - Consistency 5-5
5.2.2 Particulate Considerations 5-7
o Particle Monitoring 5-7
o Filtration Methods 5-9
5.2.3 Summary 5-13
Chapter 6 Sputtering and Evaporation Materials 6-1
6.1 Technology Issues 6-1
6.2 Purity Requirements 6-10
Chapter 7 Market Forecast 7-1
7.1 Market Driving Forces & Assumptions 7-1
7.2 Chemicals and Materials Forecast 7-3
7.2.1 Forecast By Chemical and Material 7-3
7.2.2 Chemical Use Per Unit Area Of Silicon Processed 7-21
7.2.3 Market Shares 7-23
Chapter 8 Strategic Customer Issues 8-1
8.1 Benchmarking a Vendor 8-1
8.1.1 Statistical Quality Control 8-1
o Assay and Related Items 8-3
o Trace Elements 8-4
o Particles 8-5
8.1.2 Analytical Capabilities 8-6
8.1.3 Product Manufacturing And/Or Sourcing 8-8
8.1.4 General Considerations 8-9
o Installation and Retrofitting Costs 8-9
8.2 In-House Quality Control And Assurance 8-13
8.2.1 Analytical Tools 8-13
8.2.2 How Much Testing 8-15
8.2.3 Exhaust Gas Analysis 8-16
List of Figures
4.1 Relationship Between Device Yield and Particles 4-18
4.2 Relationship Between Die Yield and Chip Size 4-20
4.3 Chemical Management Services Tasks 4-25
6.1 ITRS Roadmap 6-3
6.2 Gate-Last Approach 6-8
6.3 Gate-First Approach 6-9
7.1 Chemical/Semiconductor Revenue Ratio 7-8
7.2 Worldwide Resist Market 7-12
7.3 Resist/Semiconductor Revenue Ratio 7-13
7.4 2012 Silicon Wafer Market 7-17
7.5 2015 Silicon Wafer Market 7-18
7.6 Cost of Chemicals Per Square Inch of Silicon 7-22
7.7 Worldwide Market Shares for Gas Suppliers 7-24
7.8 Worldwide Market Shares for Liquid Chemical Suppliers 7-25
7.9 Worldwide Market Shares for Photoresist Suppliers 7-26
7.10 Worldwide Market Shares for Silicon Wafer Companies 7-27
7.12 Pricing Trend For Silicon Wafers 7-29
List of Tables
4.1 Common Wafer Processing Chemicals 4-2
4.2 Photoresist Stripping Solutions 4-10
5.1 Gas Control System Issues 5-2
5.2 Potential Hazards of Processing Gases 5-8
7.1 Worldwide Forecast of Chemicals and Materials for IC Manufacturing 7-5
7.2 Worldwide Market Forecast of Si Wafers 7-15
7.3 Worldwide Market Forecast of Sputtering Targets 7-20
